years, a gradual switch to high thermal conductivity ceramic,or metal
resin package structure, is to solve the heat dissipation, and
strengthening of the original features make efforts. LED-chip
high-power-based methods commonly used are: chip size, and to improve
the luminous efficiency, high efficiency of taking light package, and
the high-current technology. Although such practices was the proportion
of current light-emitting volume will increase, but the heat will rise.
Pairs of high-power LED package, technically speaking, due to cooling
problems caused a certain degree of distress, in this context, a
cost-effective metal substrate technology, it becomes a high efficiency
LED, after a highly concerned about the other one a new发展.
The past, because LED output power is small, such as the use of
traditional FR4 glass-epoxy substrate, and would not cause too much
heat, but applied to high-power lighting LED, the luminous efficiency
of about 20% to 30% or so, although the chip area is fairly small, the
overall consumption of electricity is not high, but the heat per unit
area is great. In general, the resin substrate of the heat, only able
to support 0.5W following LED, or more than 0.5W of LED, multi-use
metal or ceramic substrate for high-heat packaging, main reason is that
directly affect the heat dissipation substrate LED life and
performance, so substrate into the design of high brightness LED
product development focus.