For the
development of LED lighting business, "LED package" as an indispensable
technology development projects. What LED package which details should
be noted that it? What is the development of its packaging technology
trend? This article will address these questions for a detailed
explanation. Analysis of LED package and the required Every process we
can see that high-power LED packaging technology can be broken down
into: 1. Stent design (including the taking of light and heat); 2. Chip
selection and arrangement; three. Solid-crystal method; 4. linear with
the thickness of gold wire; 5. phosphor powder type and coating
structure; 6.Silicone Lens curvature and refractive index. This process
all six pairs of LED's thermal performance (thermal resistance),
luminous flux (lumens), luminous efficiency, the relative color
temperature (CCT), color rendering (CRI), the uniformity of light
color, life and other characteristics of far-reaching consequences, the
every aspect of both can not be ignored. The following will address
four of them to make a detailed analysis, and characteristics of each
LED on its impact on the relationship.
|
