1W
white LED for interfacing commercially available thermal resistance
analysis, the samples from the Lumileds company production, packaging
structures generally include grain, solder balls, substrate, silver
plastic, and cooling block and so on, as shown in Figure 10. As each part from different materials with different geometric dimensions and composed, and therefore the structure function will show a different slope of the graph changes. Structure function by measuring the cumulative figure that the size of each layer of thermal resistance. One solder ball thermal resistance of 0.8K / W, silicon plate 0.2K / W, silver plastic is about 9.1K / W, thermal block of 2.3K / W. Cumulative structure function diagram for the thermal resistance of the horizontal coordinates, vertical coordinates for the heat capacity value. By the SEM results and the cumulative structure function corresponds to the comparison chart, you can clearly determine package body layers of materials distribution curve.
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