|
The existing design
of the new LED using flip-chip (flip-chip) architecture to improve the
thermal characteristics of the chip to reduce thermal resistance and
increase the efficiency of the grain light draw. On the other hand there
are increasing use of LED die size, increased operating current to
increase the photoelectric conversion efficiency of LED in order to
obtain a larger amount of light. In addition to LED die, the white LED
fluorescent powder materials and micro-optical design technology is also
a vital and crucial packaging technologies. How to conduct an overall
light-emitting diode structure of the optical design to meet the
material properties in order to enhance the efficiency of light-emitting
element for the current hot research direction, such as grain design of
the internal structure of a reflective function and in line with plus
special micro-optical structure to enhance the efficiency of LED light.
On the other hand, improved phosphor fluorescent components in order to
increase conversion efficiency, is also the world's major optical
semiconductor plant and lighting a piece of pie makers strive to
military strategists.
|
