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JINLING Chen
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KIM Chen
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Subject: Automotive LED-Signal Lights-1156 14UHP
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2010-01-08 |
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For
large operating current of the power type LED chip, low thermal
resistance, good heat dissipation and low-stress the new package
structure is the power key technology-based LED devices. Can use low
resistance rate, high thermal conductivity material bonded chips; on
the chip plus the lower part of copper or aluminum heat sink, and
semi-encapsulation structure, speed up the heat; and even the design of
secondary cooling device to reduce the thermal resistance of the
device. Inside the device filled with transparent flexible silicone
rubber, the silicone rubber to withstand the temperature range
(typically -40 ℃ ~ 200 ℃), colloids will not sudden changes in
temperature caused by the device open, it will not appear yellowing
phenomenon. Parts and materials should take full account of its thermal
conductivity, thermal properties, in order to get a good overall
thermal characteristics. |
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