For a long
time, LED display applications has been the main demands of the heat
dissipation requirements for the LED is not very high case, LED over
traditional resin substrate package. After 2000, with the LED of high
brightness and high efficiency of technology development, coupled with
significantly improved the efficiency of blue LED light, and LED
manufacturing costs continue to decline, so that LED applications, and
the willingness of the industry-wide adoption of LED continually
increase , including liquid crystal, electrical appliances, automobile
industry, but also began to actively consider the possibility of
application of LED, such as the consumer products industry expectations
for high-power LED is to achieve energy saving, high brightness, long
life, high color reproducibility, This represents to achieve high heat
dissipation capabilities, is a high-power LED package substrate
indispensable conditions. In addition, LCD panel makers to face the EU
RoHS specifications, to confront the cold cathode fluorescent lamp will
be a comprehensive mercury-based environmental pressures, creating a
market for high-power LED needs were more urgent. LED Package In
addition to protecting the internal LED chips, but also for both LED
chips with an external electrical connections, cooling and other
functions. |
