LED die
substrate LED die substrate mainly as the LED die and the system
circuit board of the medium between the heat energy derived, by playing
lines, eutectic, or flip-chip manufacturing process combined with the
LED die. For thermal considerations, the market LED die substrate
mainly ceramic substrates mainly in order to prepare the system circuit
different methods can be divided into: Thick-film ceramic substrates,
low temperature co-fired ceramic, as well as three kinds of thin-film
ceramic substrates, in the traditional high-power LED components ,
mostly thick-film or LTCC substrate as a thermal substrate grains, and
then by playing the gold-line will be LED die and ceramic substrate
binding, but the golden thread links to limit the heat dissipation of
the effectiveness of contact along the electrode. Another way is to
look for a high thermal coefficient of the substrate material to
replace alumina, contains a silicon plate, silicon carbide substrates,
anodized aluminum plate or aluminum nitride plate, in which silicon and
silicon carbide semiconductor substrate of the material properties, so
that it at this stage to develop a more stringent, while the anodized
aluminum plate was anodized oxide layer because of its insufficient
strength and easy because of fragmentations lead to conduction, so the
more mature at this stage and a high degree of acceptance shall be
common to aluminum nitride substrates as a heat in order to prepare the
system of thin-film process Nitride Substrate greatly accelerated the
heat from the LED die through the substrate material to the system
circuit board performance, thus reducing the heat from the LED die
through a metal wire to the system circuit board of the burden, to
disperse heat Effects |
