To enhance efficiency and service life of LED light, LED products to solve heat dissipation problems shall be one of the most important
issues at this stage, LED development of the industry are also in
high-power, high brightness, small size for its LED product development
priorities, therefore, to provide with its high heat dissipation, precision cooling substrate size has also become the future trend of the development of LED thermal substrates. Aluminum
plate at this stage in order to replace the aluminum nitride
substrates, or to eutectic or flip-chip process to replace the
dozen golden grain / substrate combination of ways of increasing the
efficiency of LED light for the development of the mainstream. In this trend, the substrate itself, the line of the cooling of the bit precision requirements were very strict, and the need to have high heat dissipation, small size, metal lines and other characteristics of good adhesion, therefore, the use of yellow lithography production of thin-film ceramic substrate cooling, will be the promotion of LED continually upgrading to a higher power, one of the important catalyst.
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