Due
to the rapid development of high-power LED, so that LED light sources
have begun to enter the general lighting market, such as used in indoor
and outdoor lighting, automotive lighting and special lighting, etc.,
shown in Figure 1. Traditional
low-power type of package thermal resistance due to packaging up to
200K / W, above high-power LED can not be solved on the required
cooling demand, domestic and foreign firms to actively develop various
types of high-power package, such as the use of high thermal
conductivity of metal materials and actively developed in recent years, ceramic materials. Applied
to the LED lighting market products for the life and reliability
requirements more stringent, so its package structure must be capable
of high current density brought about by high thermal stress, to avoid
potential damage, such as chips, resin yellow, gold wire breakage and de - layer and, therefore, how to reduce the thermal resistance LED packaging technology, has become an important research topic.
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