Thermal
management is a high-brightness LED applications, the main issues
III-nitrides due to p-type doping is limited solubility of Mg acceptor
and hole higher activation energy, are particularly vulnerable to the
heat generated in the p-type region, the heat must pass the entire
structure in order to dissipate the heat sink; LED The cooling device
mainly through heat conduction and thermal convection; Sapphire
substrates led to a very low thermal conductivity of the device thermal
resistance increases, resulting in a serious self-heating effects on
device performance and reliability of devastating impact.
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