The program
will solve the thermal dissipation LED die and its substrate to the
manner of eutectic or flip-chip links, can significantly increase
throughput via the electrode wire to the system circuit board of the
thermal efficiency. However, this process for the substrate of the
wiring circuit substrate accuracy and surface roughness is extremely
demanding, so thick and low temperature co-fired ceramic substrate of
the accuracy of restricted-range screen Zhang sintering shrinkage ratio
of net issues and issues that can not be used, at this stage more to
import the thin-film ceramic substrate in order to resolve this
problem, eutectic / flip-chip manufacturing process will be
supplemented by thin-film ceramic substrates can significantly enhance
the heat-emitting LED power and product life. |
