System,
mainly as the LED circuit board cooling system, will ultimately lead to
the cooling fins heat, shell or the atmosphere material. In recent
years, printed circuit board (PCB) manufacturing technology has been
very skillful, early LED products, systems make more use of PCB-based
circuit boards, but with the increased demand for high-power LED's, PCB
cooling capacity of the materials is limited, so that it can not be
applied the high-power products, in order to improve the high-power LED
thermal problems, has recently developed a high thermal conductivity
coefficient of aluminum plate (MCPCB), the use of metallic materials
with better thermal characteristics of the characteristics of products
have reached high-power cooling purposes. However, with the LED
brightness and performance requirements of sustainable development,
despite the system board LED chip capable of effectively cooling the
heat generated into the atmosphere environment, but the heat generated
by LED die can not effectively transfer from the grain to the system
circuit plate, dissenting's, when the LED power to more efficient and
improve, the entire LED cooling bottleneck will appear in the LED die
cooling substrate, the next section the article will address the LED
die to do more in-depth discussion board.
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