|
LED
epitaxial material quality and have reached the stage can be used, but
the characteristics of the components are still a lot of space could be
improved. For example: to improve the efficiency of light out to
improve the thermal characteristics of LED to reduce junction
temperature (Junction Temperature) ... and so on, also in the
application towards the development of a large area or array-type
high-power LED, related technologies, including flip chip (Flip-Chip)
technology, the chip fitting (Wafer Bonding), optical lattice structure
(Photonic Crystal) design ⋯, etc., need to bet the energy
research and development, can only see results. |