The existing design of the new LED using
flip-chip (flip-chip) architecture to improve the thermal
characteristics of the chip to reduce thermal resistance and increase
the efficiency of the grain light draw. On the other hand there are
increasing use of LED die size, increased operating current to increase
the photoelectric conversion efficiency of LED in order to obtain a
larger amount of light. In addition to LED die, the white LED
fluorescent powder materials and micro-optical design technology is
also a vital and crucial packaging technologies. How to conduct an
overall light-emitting diode structure of the optical design to meet
the material properties in order to enhance the efficiency of
light-emitting element for the current hot research direction, such as
grain design of the internal structure of a reflective function and in
line with plus special micro-optical structure to enhance the
efficiency of LED light. On the other hand, improved phosphor
fluorescent components in order to increase conversion efficiency, is
also the world's major optical semiconductor plant and lighting a piece
of pie makers strive to military strategists.
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