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JINLING Chen
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KIM Chen
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Subject: LED Lighting-Light History
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2010-01-08 |
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For
large operating current of the power type LED chip, low thermal
resistance, good heat dissipation and low-stress the new package
structure is the power key technology-based LED devices. Can be used
with low thermal resistance rate, high thermal conductivity material
bonded chips; in the chip plus the lower part of copper or aluminum
heat sink, and semi-encapsulation structure, speed up the heat; in the
internal device, filling the flexible transparent silicone rubber, in
the silicone rubber to withstand the temperature range (typically -40 ℃
~ 200 ℃), colloids will not sudden changes in temperature caused by the
device open, it will not appear yellowing phenomenon. Parts and
materials should take full account of its thermal conductivity, thermal
properties, in order to get a good overall thermal characteristics. |
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