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JINLING Chen
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KIM Chen
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Subject: LED Lighting-JDR 1UHP
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2010-01-08 |
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LED lights began to heat from the chip to heat sink the heat
dissipated. Front-end from the LED chip to the LED base and the LED
package design-related, so I chose the chip temperature, fluorescent
powder, packaging material, as well as a low thermal resistance package
design is the most important element of the current thermal resistance
in general can reach 10K / W below better technology has reached 5K / W
standards. Then segment LED base into the air side is with the cooling
bodies.
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