As the LED packaging structure can not directly measure the grain temperature, so how to accurately measure the chip temperature to become an important topic. As
the LED gradually applied to the general lighting market, the
development of high-power LED must be more rapid, so how to upgrade the
LED structure, thermal issues, also Gejia LED industry to work together direction. Interface
thermal resistance measurement techniques by the establishment, which
can effectively help in the LED packaging industry to enhance the
quality of packaging to achieve low thermal resistance package design
needs. This technique will also help manufacturers LED quality control functions,
and failure mode analysis provides an important reference for all the
necessary information in order to enhance the competitiveness of the
domestic LED industry.
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