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JINLING Chen

KIM Chen
 
Chi ming Electronics Co., Ltd. was established in Taiwan in 1984. Has nearly 38 years of experience. Manufacturing LED car lights, LED truck lights. Serving the needs of customers is the most important goal.

News & Events>>Research & Develop

Subject: Interior LED Lighting-LED thermal expansion coefficient of epoxy resin
2010-02-05



LED thermal expansion coefficient of epoxy resin Thermal expansion refers to the size or length of an object increases with temperature and increasing the physical properties, while the thermal expansion coefficient of an object in the unit temperature changes, the material rate of change in length or volume, which indicated that the method is (coefficient × ppm ( 10-6 ℃). expansion coefficient is important to understand the physical nature of the operation of the design is also forming an important parameter. the different coefficient of thermal expansion will cause the internal stress of polymer resin, making materials, premature rupture. plastic expansion and contraction of metal is about 6 ~ 9 times. Coefficient of thermal expansion as the glass transition temperature before and after will have different values, lower than the glass transition temperature Tg, because the more brittle material present state, it will be lower coefficient of thermal expansion; one but above the glass transition temperature, due to material Softening become rubber state, will become a higher coefficient of thermal expansion. It is proposed that after the forming operation and curing temperature near the glass transition temperature, operating temperature is too high will easily lead to a high coefficient of thermal expansion, thermal stress cracking gum large produce; operating temperature is low then hardened slowly, and inconsistent production efficiency and easy to harden enough. That the use of thermal mechanical analyzer (TMA) test sample specimen of the thermal expansion coefficient, Tg results of their analysis prior to the thermal expansion coefficient of 60ppm, after the thermal expansion coefficient of