The
early rounds of the heat source model LED, in addition to a small part
of the poor heat conduction through the resin to the casual atmosphere,
go out, and the rest only a small wire through the substrate toward
dissemination of its package thermal impedance of a larger (about 250 ~
350 ℃ / W) Therefore, only applies to low-power light emitting diode package. Flat LED due to paste
together with the substrate to increase heat dissipation area, in
addition to the direction of cooling air to the outside, but also the
direction of the heat is dissipated through the substrate significantly
reduce the thermal resistance, it is the high-power LED used in the main package. Flat light-emitting diode packages may also be combined
or larger area of heat sink fins to increase heat dissipation area, to
further reduce the LED die interface temperature.
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